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[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Package warpage challenges for LQFP 144 lead CMOS 90 device and it's impact to lead coplanarity
Teng Seng Kiong,, Ruzaini, Ibrahim, Kesvakumar,, Foong Chee Seng,Year:
2010
Language:
english
DOI:
10.1109/IEMT.2010.5746703
File:
PDF, 2.33 MB
english, 2010