[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Copper electroplating for HDI and IC substrate through hole fill
Lefebvre, Mark, Barstad, Leon, Gomez, LuisYear:
2010
Language:
english
DOI:
10.1109/IMPACT.2010.5699671
File:
PDF, 1.27 MB
english, 2010