[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - Thermoelectric coupling effect on the interfacial IMC growth in lead-free solder joint
Hongwen He,, Liqiang Cao,, Hu Hao,, Guangchen Xu,, Limin Ma,, Fu Guo,Year:
2013
Language:
english
DOI:
10.1109/ISAPM.2013.6510406
File:
PDF, 1.60 MB
english, 2013