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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Fine pitch copper wire bonding process optimization with 33µm size ball bond
Jaafar, Norhanani Binte, Wai Leong Ching,, Rao, Vempati Srinivasa, Chai Tai Chong,, Trigg, Alastair David, Kanchet, Guna, Sivakumar,Year:
2011
Language:
english
DOI:
10.1109/EPTC.2011.6184521
File:
PDF, 1.04 MB
english, 2011