[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples
Herkommer, Dominik, Reid, Michael, Punch, JeffYear:
2008
Language:
english
DOI:
10.1109/EPTC.2008.4763484
File:
PDF, 10.60 MB
english, 2008