![](/img/cover-not-exists.png)
[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Optimizing solder joints on biodegradable PCBs with vapour phase soldering
Geczy, Attila, Gal, Laszlo, Hajdu, Istvan, Kovacs, Balint, Nagy, Daniel, Ruszinko, MiklosYear:
2014
Language:
english
DOI:
10.1109/ISSE.2014.6887557
File:
PDF, 884 KB
english, 2014