[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - The role of thermal properties of PCB substrates in heat dissipation of LED back light bars
Tang, C. Y., Huang, J. J., Peng, Y. L., Tsai, M. Y., Liang, PeterYear:
2012
Language:
english
DOI:
10.1109/EMAP.2012.6507882
File:
PDF, 596 KB
english, 2012