[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect
Bandyopadhyay, Tapobrata, Mehrotra, Gaurav, Iyer, Mahadevan K., Raj, P.M., Swaminathan, Madhavan, Tummala, Rao R.Year:
2008
Language:
english
DOI:
10.1109/ECTC.2008.4550134
File:
PDF, 672 KB
english, 2008