[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Assaembly induced failures in thin film MEMS packages
Zaal, J.J.M., van Driel, W.D., van Beek, J.T.M., Zhang, G.Q.Year:
2009
Language:
english
DOI:
10.1109/ESIME.2009.4938408
File:
PDF, 14.83 MB
english, 2009