Low-cost direct chip attach: comparison of SMD compatible...

IEEE Transactions on Electronics Packaging Manufacturing 2000 Vol. 23; Iss. 1

Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

R. Haug, R. Behner, C. Czaya, Hongquan Jiang, S. Kotthaus, R. Schuetz, C. Treutler
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Volume:
23
Year:
2000
Language:
english
DOI:
10.1109/6104.827521
File:
PDF, 464 KB
english, 2000
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