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[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Finite element modeling on thermal fatigue of BGA solder joints with multiple voids
Schwerz, Robert, Meyer, Sebastian, Roellig, Mike, Meier, Karsten, Wolter, Klaus-JuergenYear:
2011
Language:
english
DOI:
10.1109/ISSE.2011.6053892
File:
PDF, 972 KB
english, 2011