[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - Design-performance aspects of Glass Ceramic in comparison to Alumina Ceramic and organic FCPBGA packages for high link densities of high speed SerDes
Hu, Haitian, Na, Nanju, Baez, Franklin, Lafontant, GaryYear:
2008
Language:
english
DOI:
10.1109/EPEP.2008.4675925
File:
PDF, 489 KB
english, 2008