[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - A new process to fabricate cavities in Pyrex7740 glass for high density packaging of micro-system
Junwen Liu,, Qing-an Huang,, Jintang Shang,, Jing Song,, Jieying Tang,Year:
2008
Language:
english
DOI:
10.1109/ICEPT.2008.4606952
File:
PDF, 1.15 MB
english, 2008