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[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Thin film polymeric materials in microelectronic packaging and interconnect
Garrou, P.Year:
1998
Language:
english
DOI:
10.1109/ISAPM.1998.664433
File:
PDF, 693 KB
english, 1998