[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Prediction of Flow Induced Lead Deflection of Leadframe Assemblies in Plastic Encapsulation during Molding
Chen, J. Y., Teng, S. Y., Hwang, S. J., Lee, H. H., Huang, D. Y., Lin, Y. J., Chen, Stoke, Shen, G. S., Wu, LilyYear:
2007
Language:
english
DOI:
10.1109/ICEPT.2007.4441395
File:
PDF, 1.03 MB
english, 2007