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[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Open top mold package technology for wide range frequency optical sensors
Tzu-Yin Yen,, Wen-Chieh Chuang,, Chin-Ching Huang,, Min-Te Tu,Year:
2007
Language:
english
DOI:
10.1109/IMPACT.2007.4433561
File:
PDF, 250 KB
english, 2007