[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Mechanical characterization of next generation eWLB (embedded wafer level BGA) packaging
Yoon, S. W., Lin, Yaojian, Gaurav, Sharma, Jin, Yonggang, Ganesh, V. P., Meyer, Thorsten, Marimuthu, Pandi C., Baraton, Xavier, Bahr, AndreasYear:
2011
Language:
english
DOI:
10.1109/ECTC.2011.5898548
File:
PDF, 1.27 MB
english, 2011