[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Building Accuracies in Finite Element Models for Life Prediction of Solder Joints
Syed, Ahmer, Kim, SeokBong, Lin, WeiYear:
2007
Language:
english
DOI:
10.1109/EPTC.2007.4469763
File:
PDF, 670 KB
english, 2007