[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Research of structural factors effects on drop reliability
Wang, Jianhui, Fu, Xingming, Xie, Xiaoqiang, Zhou, Jianwei, Wang, Qian, Lee, ZaisungYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270591
File:
PDF, 1.40 MB
english, 2009