[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Jiang, Lijun, Kolluri, Seshadri, Rubin, Barry J., Smith, Howard, Colgan, Evan G., Scheuermann, Michael R., Wakil, Jamil A., Deutsch, Alina, Gill, JasonYear:
2008
Language:
english
DOI:
10.1109/EPEP.2008.4675934
File:
PDF, 3.81 MB
english, 2008