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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Micro-structural and interfacial effects on the dielectric properties of High-k aluminum/epoxy composites for embedded capacitors
Chen, Chong, Yu, Shuhui, Sun, Rong, Luo, Suibin, Weng, Lvqian, Du, RuxuYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270682
File:
PDF, 1.02 MB
english, 2009