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[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Post etch cleaning of dual damascene system integrating copper and SiLK/sup TM/
Louis, D., Peyne, C., Arvet, C., Lajoinie, E., Maloney, D., Lee, S.Year:
1999
Language:
english
DOI:
10.1109/IITC.1999.787091
File:
PDF, 264 KB
english, 1999