[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Non-destructive open fault isolation in flip-chip devices with space-domain reflectometry
Qiu, W., Tan, S.C., Tay, M.Y., Gaudestad, J., Talanov, V.V., Wei, M.S.Year:
2013
DOI:
10.1109/IPFA.2013.6599176
File:
PDF, 1.31 MB
2013