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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Heat Transfer Characteristics of Small-Sized Plate-Fin Heat Sink Array in Supercomputer
Xu, Gaowei, Xue, Jianshun, Cheng, Yingjun, Zhu, Wenjie, Le Luo,Year:
2006
Language:
english
DOI:
10.1109/ICEPT.2006.359762
File:
PDF, 6.43 MB
english, 2006