[IEEE 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Petaling Jaya, Malaysia (2007.11.8-2007.11.10)] 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Improving Solder Joint Reliability of WLP by Means of a Compliant Layer
Lee Hun Kwang,, Lee Sai Mun,, Foong, Soo Yik, Jiong, Wong SeckYear:
2006
Language:
english
DOI:
10.1109/IEMT.2006.4456439
File:
PDF, 5.47 MB
english, 2006