![](/img/cover-not-exists.png)
[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections
Mattila, T. T., Xu, H., Ratia, O., Paulasto-Krockel, M.Year:
2010
Language:
english
DOI:
10.1109/ECTC.2010.5490910
File:
PDF, 1.46 MB
english, 2010