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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Comparison study of effective power delivery in advanced substrate technologies for high speed networking applications
Priest, Judy, Pomerleau, Real, Savic, John, Aria, Percy, Xue, JieYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270784
File:
PDF, 1.25 MB
english, 2009