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[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Thermal management for stackable packages with stacked ICs
Meinshausen, L., Weide-Zaage, K., Fremont, H.Year:
2012
Language:
english
DOI:
10.1109/ESimE.2012.6191700
File:
PDF, 1.68 MB
english, 2012