A study of chip-last embedded flip-chip package

Journal of the Chinese Institute of Engineers 2014 / 08 Vol. 37; Iss. 6

A study of chip-last embedded flip-chip package

Chao, Shin-Hua, Tong, Ho-Ming, Hung, Chih-Pin, Lai, Yishao, Liu, Colin, Hsieh, Emma, Luh, Ding-Bang
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Volume:
37
Language:
english
Journal:
Journal of the Chinese Institute of Engineers
DOI:
10.1080/02533839.2013.839424
Date:
August, 2014
File:
PDF, 398 KB
english, 2014
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