Understanding and predicting electronic vibration stress using ultrasound excitation, thermal profiling, and neural network modeling
Hsieh, Sheng-Jen, Crane, Robert, Sathish, ShamacharyVolume:
20
Language:
english
Journal:
Nondestructive Testing and Evaluation
DOI:
10.1080/10589750500149149
Date:
June, 2005
File:
PDF, 688 KB
english, 2005