![](/img/cover-not-exists.png)
[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Assessment of thermo-mechanical stresses in Low Temperature Joining Technology
Herboth, Thomas, Fruh, Christiane, Gunther, Michael, Wilde, JurgenYear:
2012
Language:
english
DOI:
10.1109/esime.2012.6191762
File:
PDF, 1.83 MB
english, 2012