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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection
Zhang, Rong, Lee, S. W. Ricky, Xiao, David Guowei, Chen, HaiyingYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898727
File:
PDF, 829 KB
english, 2011