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Selective removal of 10–40-nm particles from silicon wafers using laser-induced plasma shockwaves
Peri, M. D. Murthy, Devarapalli, Vamsi K., Cetinkaya, CetinVolume:
21
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856107780684594
Date:
January, 2007
File:
PDF, 1.16 MB
english, 2007