The Study of the Polydispersivity Effect on the Thermal...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 12 Vol. 3; Iss. 12

The Study of the Polydispersivity Effect on the Thermal Conductivity of Particulate Thermal Interface Materials by Finite Element Method

Dan, Bo, Sammakia, Bah Gat, Subbarayan, Ganesh, Kanuparthi, Sasanka, Mallampati, Sandeep
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2286996
Date:
December, 2013
File:
PDF, 1.02 MB
english, 2013
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