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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Embedded wafer level ball grid array (eWLB) technology for millimeter-wave applications
Wojnowski, M., Lachner, R., Bock, J., Wagner, C., Starzer, F., Sommer, G., Pressel, K., Weigel, R.Year:
2011
Language:
english
DOI:
10.1109/eptc.2011.6184458
File:
PDF, 1.88 MB
english, 2011