Review of Recent Advances in Electrically Conductive...

Journal of Adhesion Science and Technology 2008 / 01 Vol. 22; Iss. 14

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Yim, Myung Jin, Li, Yi, Moon, Kyoung-sik, Paik, Kyung Wook, Wong, C. P.
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Volume:
22
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856108x320519
Date:
January, 2008
File:
PDF, 2.91 MB
english, 2008
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