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[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Characteristics of 600 V / 450 A IGBT module assembled by Ag sintering technology
Chang, Jing-Yao, Su-Yu Fun,, Leu, Fang-Jun, Kao, Kuo-Shu, Chih-Ming Tzeng,, Wei-Kuo Han,, Chang, Tao-ChihYear:
2014
Language:
english
DOI:
10.1109/icep.2014.6826669
File:
PDF, 564 KB
english, 2014