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Eutectic bonding of copper to ceramics for thermal dissipation applications – A review
Tuan, Wei-Hsing, Lee, Shao-KuanVolume:
34
Language:
english
Journal:
Journal of the European Ceramic Society
DOI:
10.1016/j.jeurceramsoc.2014.07.011
Date:
December, 2014
File:
PDF, 2.71 MB
english, 2014