The thermal expansion behaviour of SiCp/Al–20Si composites...

Materials & Design 2015 / 01 Vol. 65

The thermal expansion behaviour of SiCp/Al–20Si composites solidified under high pressures

Wei, Zunjie, Ma, Pan, Wang, Hongwei, Zou, Chunming, Scudino, Sergio, Song, Kaikai, Prashanth, Konda G., Jiang, Wei, Eckert, Jürgen
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Volume:
65
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2014.08.070
Date:
January, 2015
File:
PDF, 2.24 MB
english, 2015
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