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[IEEE 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Galati, Romania (2013.10.24-2013.10.27)] 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Polymer matrix composites reinforced with expanded and unexpended graphite Particles for electronic packaging applications
Tavman, Ismail, Turgut, Alpaslan, Horny, Nicolas, Chirtoc, MihaiYear:
2013
Language:
english
DOI:
10.1109/siitme.2013.6743642
File:
PDF, 243 KB
english, 2013