[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages
Tang, J., Chen, C. H., Liang, S. K., Reinders, E. G. J., Revenberg, C. Th. A., Schelen, J. B. J., Beenakker, C. I. M.Year:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575806
File:
PDF, 1.79 MB
english, 2013