[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Growth behavior of prismatic Cu6Sn5 and its effect on mechanical properties of eutectic Sn-Ag solder joints
Yang, Ming, Li, Mingyu, Kim, Jongmyung, Kim, HongbaeYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066812
File:
PDF, 2.48 MB
english, 2011