[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Waveform relaxation techniques for simulation of coupled interconnects with frequency-dependent parameters
Nakhla, N., Ruehlit, A., Nakhla, M., Achar, R., Changzhong Chen,Year:
2005
Language:
english
DOI:
10.1109/epep.2005.1563697
File:
PDF, 669 KB
english, 2005