![](/img/cover-not-exists.png)
A Tungsten Interlayer Process for Fabrication of Through-Pore AAO Scaffolds on Gold Substrates
Oh, Jihun, Shin, Yong Cheol, Thompson, Carl V.Volume:
158
Year:
2011
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3514606
File:
PDF, 461 KB
english, 2011