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[IEEE 2013 IEEE Applied Power Electronics Conference and Exposition - APEC 2013 - Long Beach, CA, USA (2013.03.17-2013.03.21)] 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) - Novel bonding and joining technology for power electronics - Enabler for improved lifetime, reliability, cost and power density
Haumann, Siegbert, Rudzki, Jacek, Osterwald, Frank, Becker, Martin, Eisele, RonaldYear:
2013
Language:
english
DOI:
10.1109/apec.2013.6520275
File:
PDF, 1.22 MB
english, 2013