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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Experimental investigation on boiling heat transfer coefficient enhancement using grooves for cooling of electronic devices
Sathyabhama, A., Prashanth, S. P.Year:
2014
Language:
english
DOI:
10.1109/itherm.2014.6892318
File:
PDF, 565 KB
english, 2014