Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders
Mahmudi, R., Geranmayeh, A. R., Noori, H., Khanbareh, H., Jahangiri, N.Volume:
26
Language:
english
Journal:
Materials Science and Technology
DOI:
10.1179/174328409x410845
Date:
August, 2010
File:
PDF, 340 KB
english, 2010