[IEEE 2013 IEEE 63rd Electronic Components and Technology...

  • Main
  • [IEEE 2013 IEEE 63rd Electronic...

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions

Yoon, Seung Wook, Tang, Patrick, Emigh, Roger, Lin, Yaojian, Marimuthu, Pandi C., Pendse, Raj
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575830
File:
PDF, 953 KB
english, 2013
Conversion to is in progress
Conversion to is failed