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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions
Yoon, Seung Wook, Tang, Patrick, Emigh, Roger, Lin, Yaojian, Marimuthu, Pandi C., Pendse, RajYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575830
File:
PDF, 953 KB
english, 2013