Single-wafer-processed nano-positioning XY-stages with...

Journal of Micromechanics and Microengineering 2006 / 07 Vol. 16; Iss. 7

Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology

Gu, Lei, Li, Xinxin, Bao, Haifei, Liu, Bin, Wang, Yuelin, Liu, Min, Yang, Zunxian, Cheng, Baoluo
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Volume:
16
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/16/7/032
Date:
July, 2006
File:
PDF, 838 KB
english, 2006
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