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The viability of anisotropic conductive film as a flip chip interconnect technology for MEMS devices
Pai, Rekha S, Walsh, Kevin MVolume:
15
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/15/6/003
Date:
June, 2005
File:
PDF, 1.09 MB
english, 2005